The HH-K01 NearLink IoT Dev Kit is a comprehensive solution that integrates software and hardware, featuring abundant communication interfaces, excellent compatibility and openness, and flexible modular design. Its main board is built on the HiSilicon WS63V100 series SOC, which includes two types: WS63 and WS63E. The WS63 features 4MB Flash, support for WiFi, SLE, BLE multi-mode concurrency, and a single-antenna channel. The WS63E, in addition to these capabilities, supports radar human activity sensing and dual-antenna channels. The kit supports multiple communication protocols and interfaces, such as NearLink, Wi-Fi, and Bluetooth, ensuring flexible and reliable communication between devices and enabling efficient and secure data transmission across different network environments. It is compatible with the open-source operating system OpenHarmony, offering developers an open, efficient, and secure system development and runtime environment. It also boasts features like low power consumption, small memory footprint, high stability, and high real-time performance. With flexible protocol support, extensibility, and multi-level development interfaces, the kit is designed with modularity in mind and integrates various key components, including sensors, microcontrollers, and communication interfaces. Developers can simplify the development process without purchasing and assembling components separately. Furthermore, the hardware and software modules support multiple expansion interfaces, such as GPIO, SPI, and I2C, meeting the expansion needs of different projects. Widely applicable in smart home, industrial control, intelligent transportation, smart logistics, smart agriculture, and smart city fields, the HH-K01 enables remote device monitoring and control, real-time data acquisition and analysis, predictive maintenance, and human presence detection.
| Parameter | Specification |
|---|---|
| CPU Subsystem | 32-bit high-performance microprocessor, maximum operating frequency 240MHz; 606KB embedded SRAM, 300KB ROM; 4MB embedded Flash. |
| Star Flash | Supports SLE 1.0; SLE 1MHz/2MHz/4MHz, WS63 max air interface rate 4Mbps, WS63E max air interface rate 12Mbps; supports Polar channel coding; supports SLE gateway. |
| Wi-Fi | 1×1 2.4GHz band (ch1~ch14); PHY supports IEEE 802.11b/g/n/ax, MAC supports IEEE 802.11d/e/i/k/v/w; supports 802.11n 20MHz/40MHz bandwidth, 802.11ax, 20MHz bandwidth; max rate 150Mbps@HT40 MCS7, 114.7Mbps@HE20 MCS9; built-in PA and LNA, integrates TX/RX Switch, Balun; supports STA and AP modes, as AP max supports 6 STA access; supports A-MPDU, A-MSDU; Block-ACK; QoS; WPA/WPA2/WPA3 personal, WPS2.0; RF self-calibration; STBC and LDPC; radar sensing (only on HH-D02 mainboard). |
| Bluetooth | Supports BLE 4.0/4.1/4.2/5.0/5.1/5.2; supports 125Kbps, 500Kbps, 1Mbps, 2Mbps rates; supports multi-path broadcasting; supports Class 1; supports high power 20dBm; supports BLE Mesh and BLE gateway. |
| Peripheral Interfaces | 1 SPI interface, 1 QSPI interface, 2 I2C interfaces, 1 I2S interface, 3 UART interfaces, 19 GPIO interfaces, 6 ADC inputs, 8 PWM paths (Note: The above interfaces are implemented through multiplexing); external crystal clock frequencies 24MHz, 40MHz. |
| Power and Environment | Typical input voltage 3.3V/5V, IO power voltage supports 3.3V; operating temperature -40℃ to +85℃. |






